SemiNex Corp
SemiNex delivers the highest available power at infrared wavelengths between 12xx and 19xx nm. When necessary we will further optimize the design of our InP laser chips to meet our customers' specific optical and electrical performance needs. Diodes, bars and packages are tested to meet customer and market performance demands. Typical results and packaging options are shown. Contact SemiNex for additional details or to discuss your specific requirements.Grin Lens f=171um used to match fast axis divergence to slow axis divergence. Tall Cap used.
SemiNex Corp
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Pulsed* TO9

Symbol TO9-147-139 Units
Wavelength λc1550nm (±20)
Output Power (<10ns) P° 25.00watts
Output Power (150ns) P° 14.00watts
Chip Cavity Length CL 2500μm
No. of Junctions 1
Emitter Width W 95μm
Emitter Height H 1μm
Spectral Width δλ 15nm 3dB
Slope Efficiency η° 0.25W/A
Fast Axis Div.* Θ_perp 14deg FWHM
Slow Axis Div. Θ_parallel 6deg FWHM
Power Conversion Eff. η 100%
Operating Current (<10ns) Iop 100A
Operating Current (150ns) Iop 50A
Threshold Current Ith 1A
Operating Voltage Vop 5V
Series Resistance Rs 0.1ohm
Weight 1.5g
Operating Temp.** -40 to 60°C
Storage Temp. -40 to 80°C

Specified values are rated at a constant heat sink temperature of 20°C.
**Specified operating conditions are based on 20C heat sink temperature. High temperature operation will reduce performance and MTTF.
Unless otherwise indicated all values are nominal.
Uncapped TO9 specifications assume heatsinking underneath laser chip.
Capped TO9 specifications assume heatsinking only on flat surface where pins extend.

All statements, technical information and recommendations related to the product herein are based upon information believed to be reliable or accurate. The accuracy or completeness herein is not guaranteed, and no responsibility is assumed for any inaccuracies. The user assumes all risks and liability whatsoever in connection with the use of a product or its application. SemiNex Corporation reserves the right to change at any time without notice the design, specification, deduction, fit or form of its described herein, including withdrawal at any time of a product offered for sale herein. Users are encouraged to visit for the latest data. SemiNex Corporation makes no representations that the products herein are free from any intellectual property claims of others. Please contact SemiNex for more information. � 2016 SemiNex Corporation

SemiNex Corporation ● 100 Corporate Place ● Peabody, MA 01960 ● 978-326-7700 ● Email: ●

Date Created: Oct 25 2020 8:18PM UTC