SemiNex delivers the highest available power at infrared wavelengths between 12xx and 19xx nm. When necessary we will further optimize the design of our InP laser chips to meet our customers' specific optical and electrical performance needs. Diodes, bars and packages are tested to meet customer and market performance demands. Typical results and packaging options are shown. Contact SemiNex for additional details or to discuss your specific requirements.
4-Chip Module
High Power Multi-Mode SemiNex Lasers
12xx to 19xx nm
Custom Wavelengths Available
Applications
OEM Medical
DPSS pump source
Free Space Communications
Military / Aerospace
Thermal Processing
Features
High Power Multi Chip Laser Assembly
Fiber Bundle Assembly for low cost
High Dynamic Range
High Efficiency
Red Aiming Beam Optional
Designed for Volume Applications
1470nm Multi Chip Modules
Specified values are rated at a constant heat sink temperature of 20°C.
**Specified operating conditions are based on 20C heat sink temperature. High temperature operation will reduce performance and MTTF.
Unless otherwise indicated all values are nominal.
• All MCM units contain monitor photodetectors to monitor lasing operation •
• Custom wavelengths available •
• Contact SemiNex for details •
1532 nm Multi Chip Modules
Specified values are rated at a constant heat sink temperature of 20°C.
**Specified operating conditions are based on 20C heat sink temperature. High temperature operation will reduce performance and MTTF.
Unless otherwise indicated all values are nominal.
• All MCM units contain monitor photodetectors to monitor lasing operation •
• Custom wavelengths available •
• Contact SemiNex for details •
1550 nm Multi Chip Modules
Specified values are rated at a constant heat sink temperature of 20°C.
**Specified operating conditions are based on 20C heat sink temperature. High temperature operation will reduce performance and MTTF.
Unless otherwise indicated all values are nominal.
• All MCM units contain monitor photodetectors to monitor lasing operation •
• Custom wavelengths available •
• Contact SemiNex for details •
Accessories and Options
Single core multimode SemiNex patch cable
550um core with 600um cladding
The single core multimode SemiNex patch cable offers a solution to bundled fiber multi-chip modules. Both ends are terminated with a SMA-905 connector
and are AR coated for maximum performance. Contact SemiNex for additional details or to discuss your application.
Integrated Cooling System
SemiNex offers our high power multi-chip module with an integrated cooling solution. The ICS will extract up to 200 watts of thermal heat. This
compact cooling system can be easily integrated with your existing controls and laser driver to reduce design time required to manage heat.
Physical Characteristics—Fiber Bundled
'
Operating Conditions: 10 to 30 C
Storage Conditions: -20 to 80 C
MCM mass: ~550g
All statements, technical information and recommendations related to the product herein are based upon information believed to be reliable
or accurate. The accuracy or completeness herein is not guaranteed, and no responsibility is assumed for any
inaccuracies. The user assumes all risks and liability whatsoever in connection with the use of a product or its application.
SemiNex Corporation reserves the right to change at any time without notice the design, specification, deduction, fit or form of its described
herein, including withdrawal at any time of a product offered for sale herein. Users are encouraged to visit www.seminex.com for the latest
data. SemiNex Corporation makes no representations that the products herein are free from any intellectual property claims of others.
Please contact SemiNex for more information. � 2016 SemiNex Corporation
SemiNex Corporation ● 153 Andover St ● Danvers, MA 01923 ● 978-326-7700 ● Email: info@seminex.com ● www.seminex.com
Date Created: Apr 19 2024 6:57AM UTC